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5筆商品,1/1頁
Advances in 3d Integrated Circuits and Systems
滿額折
作者:Hao Yu; Chuan Seng Tan  出版社:World Scientific Pub Co Inc  出版日:2015/12/29 裝訂:平裝
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers under
定價:1972 元, 優惠價:9 1775
無庫存,下單後進貨(採購期約4~10個工作天)
Advances in 3d Integrated Circuits and Systems
滿額折
作者:Hao Yu; Chuan Seng Tan  出版社:World Scientific Pub Co Inc  出版日:2015/12/29 裝訂:精裝
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers under
定價:4692 元, 優惠價:9 4223
無庫存,下單後進貨(採購期約4~10個工作天)
Physical Design for 3d Integrated Circuits
作者:Aida Todri-sanial (EDT); Chuan Seng Tan (EDT)  出版社:Productivity Press  出版日:2015/12/17 裝訂:精裝
This book unveils how to effectively and optimally design 3D circuits. It covers the necessary design tools for 3D circuits while exploiting the benefits of 3D technology. An overview of physical desi
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Wafer Level 3-D ICs Process Technology
作者:Chuan Seng Tan (EDT); Ronald J. Gutmann (EDT); L. Rafael Reif (EDT); Scott List (FRW)  出版社:Springer Verlag  出版日:2008/10/01 裝訂:精裝
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, t
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
3D Integration for VLSI Systems
作者:Chuan Seng Tan (EDT); Kuan-neng Chen (EDT); Steven J. Koester (EDT)  出版社:Pan Standford  出版日:2011/09/26 裝訂:精裝
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented cha
若需訂購本書,請電洽客服
02-25006600[分機130、131]。

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