Sarah Y. Tong

In the past three decades, China has successfully transformed itself from an extremely poor economy to the world’s second largest economy. The country’s phenomenal economic growth has been sustained p

In the past three decades, China has successfully transformed itself from an extremely poor economy to the world’s second largest economy. The country’s phenomenal economic growth has been sustained p

The current global financial turmoil, triggered by the US subprime crisis, has spread quickly and resulted in the worst global economic crisis since the 1930s. As the world’s third largest economy and

"Asian countries are undergoing rapid political, economic and social transformations; meanwhile, there is a growing demand for knowing more about Asia. This major reference set is designed to help gen

Statistical Theories and Methods with Applications to Economics and Business highlights recent advances in statistical theory and methods that benefit econometric practice. It deals with exploratory d

This comprehensive volume deciphers investigative process and practice, providing an authoritative insight into key debates and contemporary issues in crime investigations Provides critical examinati

This comprehensive volume deciphers investigative process and practice, providing an authoritative insight into key debates and contemporary issues in crime investigations Provides critical examinati

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineersSemiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others.For materials scientists and electrical engineers who need to exploit th