Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at AMC 2001 include the latest developments in integrating copper metallization with low-dielectric constant materials, and evaluations of the reliability of such interconnects. Recently, in both industry and academia there has been increased interest in basic research as applied to the field of vertical integration. Since the problems that affect vertical integration are similar to those of VLSI interconnects, it is natural to include the topic here. In fact, it is anticipated that cross fertilization between the fields of VLSI metallization and vertical interconnect will yield a viable technical solution to the problem of multichip integration. This book offers a comprehensive look at the current state of the art of VLSI interconnects. Topics include: process integration; vertical
Solar-cell performance is critically dependent on the optical and electrical properties of their constituent materials. In order to obtain significant improvements in performance for future generations of photovoltaic devices, it will be necessary to either improve the properties of existing materials or engineer new materials and device structures. This book focuses on materials issues and advances for photovoltaics. Topics include: dye-sensitized solar cells; nanoparticle/hybrid solar cells; polymer-based devices; small molecule-based devices; III-V semiconductors; II-VI semiconductors and transparent conducting oxides and silicon thin films.
Rapid advances in complex macromolecular synthesis and the fabrication of nanostructures have provided expansive opportunities for the development of new materials with unique optical and nonlinear optical properties. Key to continual progress is the establishment of robust structure-property-processing relationships that will provide a framework to evaluate ultimate potential, articulate relevant figures of merit, and engineer materials systems for specific applications. Success necessitates interactions across diverse disciplines spanning theory, synthesis, fabrication, characterization and device evaluation for photonic applications. This book addresses the challenges associated with the synthesis, theory and characterization of new compounds and nanostructured materials that exhibit, or are formed, using unique photophysics. Topics include: nonlinear optical properties materials; nonlinear optical materials; organometallic optical materials; plasmonics; electro-optical and
Future advancements in MEMS, aerospace applications, information storage, biotechnology and many other fields will require extensive use of engineered surfaces and interfaces. While many surface modification processes are available today, the application of these processes, as well as an understanding of their limitations, will require a fundamental knowledge of a broad spectrum of processing and properties issues. New experimental techniques show promise in helping to advance the technology of engineered surfaces. This book covers a range of topics related to surface engineering, surface modification and surface mechanics and reflects the interactions of researchers from many fields whose goal it is to enhance performance of engineered components and devices. Topics include: the effects of coating nanostructure on hardness; new developments in super-low friction coatings; control of stresses during surface modification; modification of surfaces and coatings using ion beams and lasers;
Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
As more advanced materials find their way into daily life, a better understanding of degradation processes is required, allowing us to more accurately predict their lifetime and further increase their performance, reliability. While degradation processes are initiated at molecular (subnanometer) scale, the nanostructure and nanoconfinement of materials alter the degradation processes occurring in materials at micron or larger scales, and eventually trigger new degradation routes. This book studies the effect of nanometer-scale structure and confinement on degradation processes and analyzes the experimental and theoretical approaches used to estimate the lifetime of nanostructured and nanoconfined materials in various environments. Various topics are addressed - from electronic, optical, structural, and magnetic nanomaterials to space, chemical, biological and medical applications. There is also an emphasis on the time dependence associated with artificial treatments involving
Solid-state ionics is at the foundation for the development of environmentally friendly devices such as batteries and fuel cells for energy storage and conversion, and chemical sensors for pollution monitoring and control. The progress of such devices is crucial for sustainable development. Further insight into the study of fundamentals of ion transport and interfacial phenomena in advanced materials, including ceramics, glasses, polymers, composites and hybrids will allow better design, fabrication and performance of devices for their extensive use. This book is intended to help promote the fundamental understanding of ionic (including protonic) and electronic transport in solids, especially of interfacial transport, including the developing field of nanostructured materials. Contributions encompass fundamental materials R&D, characterization and materials for batteries, sensors, membranes, and fuel cells. Special emphasis is given to the development of high-temperature proton
The scope of detector materials for semiconductors and scintillators includes a wide variety of molecular compounds such as cadmium zinc telluride (CZT), lanthanum halides, and others. An additional class of scintillators is based on organic compounds and glasses. Ideally, attributes of materials used for radiation detection include appropriate-range bandgaps, high atomic numbers of the central element, high densities, performance at room temperature, strong mechanical properties, and low production cost. Unfortunately, there are significant gaps in the knowledge required to produce radiation detection materials of higher quality - in terms of reproducible purity, homogeneity and mechanical integrity. This book explores results in radiation detection materials from both experimental and theoretical standpoints, as both are needed to grow and characterize materials that will produce better detectors in the future.
It is increasingly apparent that ion-beam-based processing offers unique capabilities for fabrication and complex patterning of 3D, 2D or 1D structures at the few-nanometer scale (e.g., nanowires and quantum dots), and for custom tailoring of nanocomposites, nanoporous materials, catalyst surfaces, optical materials and nanoparticle assemblies. This book addresses achievements, applications and insights into such areas. It also seeks to identify potential dimensional limitations to the future practical implementation of this approach. Topics include: ion-beam nanofab - tools, techniques and applications; patterning, quantum dot synthesis and self assembly; and examples - applications and devices.
This book gives evidence of the proliferation of successful multidisciplinary collaborations among researchers in museums, universities and laboratories. These studies use the methods and techniques of materials research to understand degradation and design strategies and promote long-term preservation of material culture and cultural heritage, e.g., works of art, culturally significant artifacts, and archaeological sites and complexes and their environments. Preserving cultural heritage includes developing a critical understanding of how our predecessors used technology and craft to solve problems of survival and organization and make the symbols or representations of what was important to them. The book also discloses patterns of technology-transfer from one field to another and provides evaluation tools and skills so that preservation expectations may be based on performance criteria and life histories of the constituent materials. Topics include: technical art history
Superconductors are entering a new age where they will be much more commonplace. High-temperature superconductors (HTS) are currently in the marketplace for rf filter applications and are coming into power applications as wires for cables, fault current limiters and motors/generators. Critical to enabling these developments are the great advances over the last decade-and-a-half in preparation of high-quality materials. Equally exciting, new superconductors are emerging and a better understanding of the cuprates is evolving. The three-year-old MgB2 superconductor appears to be now moving on to the applications arena as well. This book offers a diverse collection of timely presentations on these new frontiers in superconducting materials. Topics include: developments in second-generation HTS wire, known as coated conductors; progress in first-generation HTS wire towards better performance and manufacturing; MgB2 materials developments, especially thin films and wires; rf applications
More and more researchers are recognizing the importance of patterning materials into well-defined structures and their immediate impacts to many areas that include physics, chemistry, biology, and engineering. Compared to traditional lithographic techniques, nontraditional approaches (e.g., self-assembly, soft lithography, embossing, dip-pen lithography, scanning probe lithography and lase- induced patterning) provide avenues to explore new scientific phenomena, as well as to realize new devices in microelectronics, photonics, sensors, MEMS, and lab-on-chip systems with lower cost, higher throughput, and larger quantities. The ability to directly pattern materials in three dimensions (e.g., self-assembly, two-photon absorption and interference lithography) with tailored shape, size, and chemistry provides unparalleled control over material structures and properties. In this book, a wide range of researchers exchange views, learn about the latest advancement in materials science and
Progress in nanoscale engineering, as well as an improved understanding of the physical phenomena at the nanometer scale, have contributed to the rapid development of novel nanostructured semiconducting materials and nanodevices. Using new approaches, semiconductor structures can be fabricated with sub-nanometer accuracy and precisely controlled electronic and optical properties. The immense technological potential and new exciting physics have stimulated interest in semiconductor nanostructures over several years. This book brings together a single comprehensive overview of recent progress and future directions in nanoscale semiconductor research. Fields ranging from materials science to physics, chemistry, electrical and microelectronic engineering, circuit design, and more, are represented. Topics include: quantum dot theory, growth and optics; single quantum dot spectroscopy; charge and spin; Si/Ge quantum dot structures; bio-quantum dots; electric force microscopy and charge
This book combines the proceedings of Symposium EE, Solid-State Ionics, and Symposium FF, Materials for Fuel Cells and Fuel Processors, both from the 2002 MRS Fall Meeting in Boston. Developments in solid-state ionics, and advances in the domains of energy storage and conversion and environmental monitoring, are featured. The largest clusters of papers are devoted to lithium batteries and fuel cell technology. It reflects the dominating relevance of these applications for fostering the modern telecommunications and information society and the development of environmentally friendly electric transportation and energy transformation systems, replacing traditional combustion technology. Topics include: theory/inorganic ion conductors; oxide electroceramics for separation membranes and gas sensors; cathode materials for lithium batteries; anode materials for lithium batteries and polymer electrolytes; proton exchange membrane fuel cells; and solid oxide fuel cells.
This symposium was held to commemorate the 40th anniversary of the National Aeronautics and Space Administration (NASA); it was also the 25th anniversary of the Materials Research Society. The coincidence of anniversaries provided an excellent opportunity to consider how materials science has contributed to the space program, and how it will continue to contribute to the future of space exploration. Living and working in space presents extreme challenges that have only begun to be met by the materials research community. This book brings together researchers from government, industry and university laboratories to discuss successes and ongoing research in the application of materials science to the space program. Topics include: space exploration; space photovoltaics; materials for energy conversion and storage; fundamental studies for advanced materials and devices; microgravity materials processing; and materials for space and other hostile environments. Commercial spin-offs from
Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included. Topics include: overview and oxide polishing; pads and related issues; metal polishing - W and Al; copper polishing and related issues; CMP modeling and fluid flow; and particle adhesion and post-polish cleaning.
Microelectromechanical systems (MEMS) hold great promise for sensing and actuating on the micron scale. There is a hierarchy of increasing difficulty for placing MEMS devices in the field. Devices that do not allow contact between structural members rely mainly on mechanical properties of freestanding films. High-resolution techniques must be developed within the framework of MEMS to measure properties such as modulus and residual stress. When contact and rubbing contact are allowed, the complexities of adhesion and friction at the microscale must be understood and well controlled. Fluid interactions are similarly important for microfluidic devices. Packaging of MEMS for use in the field also requires special consideration, because it is often application specific. This book investigates various materials, characterization methods and processing techniques. These approaches represent different but useful strategies to solve MEMS challenges, and must be integrated for product
The mechanical properties of small volumes of materials such as thin films and patterned structures can be very different from the mechanical properties of those same materials in bulk. Many explanations of the mechanical behaviors of such small volumes have depended on simplified models of dislocation behavior. However, recent developments in dislocation modeling have made it possible to understand dislocation behavior in much more detail than before. A wide range of topics is presented in these proceedings, including mechanisms of plastic deformation in heteroepitaxial, multilayered and polycrystalline thin films, as well as three-dimensional mesostructures such as epitaxial islands, semiconducting devices and microcrystallites. Experimental, theoretical and numerical simulations are addressed. Topics include: dislocation and deformation mechanisms in thin metal films and multilayers; discrete dislocations - observations and simulations; dislocations and deformation mechanisms in
With the developing progress of materials fabrication, it is possible to produce materials with exciting electronic and magnetic properties which may be candidates for future device applications. One key class of these materials is the metallic magnetic oxide systems. This book focuses on colossal magnetoresistance (CMR) materials, including manganites and cobalites. Transport and magnetic properties and their dependence on stress, growth conditions, stoichiometry and elemental composition are explored quite extensively. However, the large magnetic fields required to obtain the CMR effect have been perceived as a technological roadblock for commercialization of this phenomenon. This has motivated research aimed both at reducing the intrinsic field dependence as well as at developing novel device structures that will reduce the required effective field. Technologically useful devices will undoubtedly involve heterostructures. Since the magnetic and transport properties are extremely
