ROUTING IN THE THIRD DIMENSION:FROM VLSI CHIPS TO MCMS
商品資訊
ISBN13:9780780310896
出版社:JOHN WILEY & SONS;LTD
作者:SHERWANI
出版日:1995/02/15
裝訂/頁數:精裝/376頁
定價
:NT$ 7018 元優惠價
:
90 折 6316 元
絕版無法訂購
商品簡介
目次
商品簡介
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
目次
Preface.
Acknowledgments.
Introduction.
Graphs and Basic Algorithms.
Channel Routing and Terminal Assignment.
Routing Models.
Basic Problems in Routing.
Routing Algorithms for the Two-Layer Process.
Routing Algorithms for the Three-Layer Process.
Routing Algorithms for the Advanced Three-Layered Process.
Routing Algorithms for Advanced VLSI and Thin-Film MCMs.
Routing Algorithms for General MCMs.
Bibliography.
Author Index.
Subject Index.
Acknowledgments.
Introduction.
Graphs and Basic Algorithms.
Channel Routing and Terminal Assignment.
Routing Models.
Basic Problems in Routing.
Routing Algorithms for the Two-Layer Process.
Routing Algorithms for the Three-Layer Process.
Routing Algorithms for the Advanced Three-Layered Process.
Routing Algorithms for Advanced VLSI and Thin-Film MCMs.
Routing Algorithms for General MCMs.
Bibliography.
Author Index.
Subject Index.
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