商品簡介
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.
The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.
By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
作者簡介
Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.
Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.
目次
SEMICONDUCTOR PACKAGESHistory and BackgroundObjectivesIntroductionBrief historyWire bonding process flowFlip-chip process flow comparisonEquipmentMaterial interactions
Package Form Factors and FamiliesObjectivesIntroductionPackage outline standardizationLeaded package familiesQuad lead package familySubstrate-based package familiesChip scale packagesStacked-die package familyPackage-on-package and related variationsFlip-chip packagesWafer-level chip scale packages
Surface-Mount TechnologyObjectivesIntroductionBackgroundPackage cracking or "popcorning"Surface-mount packages: peripheral leads versus area arrayIssues with advanced packagingCurrent and future trends
Other Packaging NeedsObjectivesIntroductionTape automated bondingMicro electro-mechanical systems (MEMS)Image sensor modulesMemory cardsPackaging needs for solar technology
PACKAGE RELIABILITYReliability TestingIntroductionBackgroundExamples of reliability testsLimitations of reliability testing
MATERIALS USED IN SEMICONDUCTOR PACKAGINGPolymersMolding compoundsDie attach adhesivesUnderfill materialsOrganic substrates
MetalsLead frames, heat spreaders, and heat sinksBonding wiresSoldersWafer bumping
Ceramics and GlassesObjectivesIntroductionTypes of ceramics used in semiconductor packagingTypes of glasses used in semiconductor packaging
THE FUTURETrends and ChallengesObjectivesIntroductionCopper interconnects and low-κ dielectric materials Dielectric constant requirements at each technology nodeFuture interconnect and dielectric materialsFuture packaging options
Light-Emitting DiodesObjectivesIntroductionUnique characteristics of light-emitting diode (LED) packaging needsReliability requirements for LED packages
Appendix A: Analytical ToolsAppendix B: Destructive Tools and Tests
Index
Bibliography appears at the end of each chapter.
