商品簡介
The 26 papers look at electronic packaging from the perspectives of the system in package; advanced packaging and nanotechnology; physical, mechanical, electromagnetic, and thermal behavior; and thin films and adhesives. Among the topics of invited papers are process and material requirements for the successful heterogonous passive component integration in radio-frequency systems, smart lead-free solders through shape-memory alloy reinforcement, and compression creep behavior of the 95.5Sn-Ag-Cu solders. Annotation c2007 Book News, Inc., Portland, OR (booknews.com)
