商品簡介
Proceedings of the Advanced Metallization for ULSI Applications Conference, held jointly in the US and Japan in October 1993. Some 70 papers, including seven invited papers, are arranged in 11 parts: copper metallization; titanium nitride CVD; collimated sputtering and contact metallization; aluminum reliability and microstructure; selective aluminum CVD; blanket tungsten CVD; selective tungsten CVD; silicides; process integration and manufacturing technology; gold metallization; and topical workshop summaries (barrier metallization, advanced Al metallization, Cu metallization). Annotation copyright Book News, Inc. Portland, Or.
