商品簡介
In these proceedings for the symposium held March and April 2005, contributors describe their work in the mechanical behavior of thin films, broadly applied to their material's choice or methodology. General topics of these 65 papers include elasticity in thin films, characterizing thin films by nanoindentation, mechanical behavior of nanostructured films, testing and analysis of mechanical properties of thin films, size effects of thin film plasticity, creep in thin film elasticity, modeling of thin film plasticity, novel testing techniques (including thermal expansion of low dielectric constant thin films by high-resolution x-ray reflectivity and an investigation of local stress fields through finite element modeling and high-resolution x-ray diffraction), in-situ characterization techniques, adhesion and fracture, fatigue and stress in interconnect and metallization, information growth and microstructure in thin films, characterizing thin film growth stresses and thin film processing. Papers contain their own references and the editors provide subject and author indices. Annotation c2006 Book News, Inc., Portland, OR (booknews.com)
