Design of 3d Integrated Circuits and Systems ― Multicore Architecture, Thermal Management, and Reliability
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商品簡介
3D integration of microsystems and subsystems has become imperative to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.
This book tackles all aspects of 3D integration, including 3D circuit and system design, new process development, application of novel materials, and thermal challenges for restricting power dissipation. Presenting a coherent approach that takes into account distinct yet interrelated issues, the text discusses the use of interposer technology and the role of through-silicon vias (TSVs), as well as revisits traditional cooling techniques in view of the vertical interconnection of stacked subsystems.
作者簡介
Rohit Sharma is faculty at the Indian Institute of Technology Ropar, Punjab. He previously worked as a post-doctoral researcher at Seoul National University, South Korea and at Georgia Institute of Technology, Atlanta, USA. Dr. Sharma has authored/co-authored over 50 journal and conference publications, one book, one book chapter, two patents/copyrights, and several invited talks. He was a recipient of the Brain Korea Research Fellowship (2010), the Indo-US Research Fellowship (2011), and Best Paper Awards in ASQED 2010 and GIT 2011 conferences. An IEEE and ACM member, he has served as a journal referee and committee member/session co-chair on multiple occasions.
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