Electronic Packaging Materials and Their Properties
商品資訊
系列名:Electronic Packaging Series
ISBN13:9780849396250
出版社:Taylor & Francis
作者:Michael G. Pecht (EDT); Rakesh Agarwal; Patrick McCluskey; Terrance Dishongh; Sirus Javadpour; Rahul Mahajan
出版日:1998/11/01
裝訂/頁數:精裝/114頁
規格:24.8cm*16.5cm*1.3cm (高/寬/厚)
定價
:NT$ 12000 元若需訂購本書,請電洽客服 02-25006600[分機130、131]。
商品簡介
商品簡介
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
interconnections
printed circuit boards
substrates
encapsulants
dielectrics
die attach materials
electrical contacts
thermal materials
solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
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