2D-Materials for Energy Harvesting and Storage Applications
商品資訊
ISBN13:9783030960209
出版社:Springer Nature
作者:Muhammad Ikram
出版日:2022/03/02
裝訂:精裝
規格:23.4cm*15.6cm*1.6cm (高/寬/厚)
定價
:NT$ 10439 元若需訂購本書,請電洽客服 02-25006600[分機130、131]。
商品簡介
商品簡介
Chapter 1
Introduction1.1 Background1.2 Why 2D materials?References
Chapter 2Advances in Ultrathin 2D Materials2.1 Revolution of 2D materials2.2 Recent advances2.2.1 Research highlights2.3 Classification of 2DMs2.3.1 Layered van der Waals solids2.3.2 Layered ionic solids2.3.3 Surface assisted non-layered solidsReferences
Chapter 3Composition and Materials Chemistry3.1 Graphene3.1.1 Structural chemistry3.1.2 Edge alignment in graphene3.1.3 Band engineering3.2 Transition metal dichalcogenides3.2.1 Structural chemistry3.3 Mxenes3.3.1 Crystal structure3.4 g-C3N43.4.1 Crystal structure3.5 Covalent organic frameworks3.5.1 Design principle3.5.1.1 Symmetric topologies3.5.1.2 Asymmetric topologies3.6 Metal-organic framework3.6.1 Structural chemistryReferences
Chapter 4Synthetic Protocols4.1 Micromechanical cleavages4.1.1 Scotch tape method4.1.2 Viscoelastic stamps4.1.3 Sandpaper-assisted exfoliation4.1.4 Electrostatic-assisted exfoliation4.1.5 Wet-grinding technique4.1.6 Wet-jet milling method4.1.7 Liquid exfoliations4.1.7.1 Sonication-assisted liquid exfoliation4.1.7.1.1 Sonication type and power4.1.7.1.2 Sonication time4.1.7.2 Shear force-assisted liquid exfoliation4.2 Ion intercalation exfoliation4.2.1 Intercalation routes4.2.1.1 Chemical intercalation4.2.1.2 Electrochemical intercalation4.2.1.3 Intercalation chemistry of 2D materials4.2.1.4 Mechanism4.3 Oxidation-assisted exfoliation4.4 Wet-chemical syntheses4.4.1 Hydro/Solvothermal synthesis4.4.2 2D-oriented attachment4.4.3 Self-sssembly of nanocrystals4.4.4 2D-templated synthesis4.4.5 Hot-injection method4.4.6 Interface-mediated synthesis4.4.7 Other WC-synthesis methods4.5 Chemical vapor deposition4.5.1 Graphene and hexagonal Boron Nitride4.5.1.1 Effect of substrate4.5.1.2 Effects of precursor and pressure4.5.1.3 Wafer-scale growth4.5.2 Transition metal dichalcogenides4.5.2.1 Effects of precursor and seed4.5.2.2 Substrate engineering4.5.2.3 Effect of temperature and gas4.5.2.4 Layer-controlled and patterned growthReferences
Chapter 52D-Heterostructures5.1 Advances in 2D-van der Waals heterostructures5.2 Properties5.2.1 Band tuning5.2.2 Charge transportation in 2D heterostructures5.2.2.1 Mono-particle transports5.2.2.2 Generation of interlayer excitons5.2.3 Magnetism in 2D heterostructures5.3 Fabrication5.3.1 Mechanical transfer methods5.3.2 CVD growth5.3.2.1 One-step CVD method5.3.2.2 Two-step CVD method5.3.2.3 Multi-step CVD method5.3.2.4 Vertically stacked 2D heterojunctions5.3.2.5 Laterally stacked 2D heterojunctions5.3.3 Doping and chemical functionalization5.3.4 Electrostatically assembled heterostructures5.3.4.1 Flocculation5.3.4.2 Langmuir-Blodgett assembly5.4 Advance applications of 2D-heterostructures5.4.1 Tunneling devices5.4.2 Interaction with light5.4.2.1 Photovoltaic applications5.4.2.2 Light-emitting diodes5.4.3 Plasmonic devicesReferences
Chapter 6Energy-related A
Introduction1.1 Background1.2 Why 2D materials?References
Chapter 2Advances in Ultrathin 2D Materials2.1 Revolution of 2D materials2.2 Recent advances2.2.1 Research highlights2.3 Classification of 2DMs2.3.1 Layered van der Waals solids2.3.2 Layered ionic solids2.3.3 Surface assisted non-layered solidsReferences
Chapter 3Composition and Materials Chemistry3.1 Graphene3.1.1 Structural chemistry3.1.2 Edge alignment in graphene3.1.3 Band engineering3.2 Transition metal dichalcogenides3.2.1 Structural chemistry3.3 Mxenes3.3.1 Crystal structure3.4 g-C3N43.4.1 Crystal structure3.5 Covalent organic frameworks3.5.1 Design principle3.5.1.1 Symmetric topologies3.5.1.2 Asymmetric topologies3.6 Metal-organic framework3.6.1 Structural chemistryReferences
Chapter 4Synthetic Protocols4.1 Micromechanical cleavages4.1.1 Scotch tape method4.1.2 Viscoelastic stamps4.1.3 Sandpaper-assisted exfoliation4.1.4 Electrostatic-assisted exfoliation4.1.5 Wet-grinding technique4.1.6 Wet-jet milling method4.1.7 Liquid exfoliations4.1.7.1 Sonication-assisted liquid exfoliation4.1.7.1.1 Sonication type and power4.1.7.1.2 Sonication time4.1.7.2 Shear force-assisted liquid exfoliation4.2 Ion intercalation exfoliation4.2.1 Intercalation routes4.2.1.1 Chemical intercalation4.2.1.2 Electrochemical intercalation4.2.1.3 Intercalation chemistry of 2D materials4.2.1.4 Mechanism4.3 Oxidation-assisted exfoliation4.4 Wet-chemical syntheses4.4.1 Hydro/Solvothermal synthesis4.4.2 2D-oriented attachment4.4.3 Self-sssembly of nanocrystals4.4.4 2D-templated synthesis4.4.5 Hot-injection method4.4.6 Interface-mediated synthesis4.4.7 Other WC-synthesis methods4.5 Chemical vapor deposition4.5.1 Graphene and hexagonal Boron Nitride4.5.1.1 Effect of substrate4.5.1.2 Effects of precursor and pressure4.5.1.3 Wafer-scale growth4.5.2 Transition metal dichalcogenides4.5.2.1 Effects of precursor and seed4.5.2.2 Substrate engineering4.5.2.3 Effect of temperature and gas4.5.2.4 Layer-controlled and patterned growthReferences
Chapter 52D-Heterostructures5.1 Advances in 2D-van der Waals heterostructures5.2 Properties5.2.1 Band tuning5.2.2 Charge transportation in 2D heterostructures5.2.2.1 Mono-particle transports5.2.2.2 Generation of interlayer excitons5.2.3 Magnetism in 2D heterostructures5.3 Fabrication5.3.1 Mechanical transfer methods5.3.2 CVD growth5.3.2.1 One-step CVD method5.3.2.2 Two-step CVD method5.3.2.3 Multi-step CVD method5.3.2.4 Vertically stacked 2D heterojunctions5.3.2.5 Laterally stacked 2D heterojunctions5.3.3 Doping and chemical functionalization5.3.4 Electrostatically assembled heterostructures5.3.4.1 Flocculation5.3.4.2 Langmuir-Blodgett assembly5.4 Advance applications of 2D-heterostructures5.4.1 Tunneling devices5.4.2 Interaction with light5.4.2.1 Photovoltaic applications5.4.2.2 Light-emitting diodes5.4.3 Plasmonic devicesReferences
Chapter 6Energy-related A
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