滿額折
MicroSystem Based on SiP Technology
商品資訊
ISBN13：9789811900822
出版社：Springer Nature
作者：Suny Li(EDI)
出版日：2022/05/29
裝訂：精裝
規格：23.4cm*15.6cm*4.6cm (高/寬/厚)
定價
：NT$ 14499 元若需訂購本書，請電洽客服 02-25006600[分機130、131]。
商品簡介
商品簡介
From Moore's law to Function Density Law.- From SiP to Si3P.- SiP Technology and MicroSystem.- From 2D to 4D Integration.- SiP and Advanced Packaging Technology.- SiP Design, Simulation and Verification Platform.- Establishment and Management of Central Library.- SiP Schematic Design Input.- Creation and Setting of Layout.- Management of Design Rules.- Wire Bonding Design in Detail.- Cavity, Chip Stack and TSV design.- RDL and Flip Chip Design.- Layout Route and Plane.- Embedded Passive Design.- RF Circuit Design.- Rigid-Flex Circuits and 4D SiP Design.- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) .- Design Review and Production Data Output.- SiP Simulation and Verification Technology.- Large Capacity Storage SiP Design Case.- SiP Project Planning and Design Case.- 2.5D TSV Technology and Design Case.- Digital T/R Module SiP Design Case.- MEMS Verification SiP Design Case.- Rigid-Flex SiP Design Case.- RF System Integrated SiP Design Case.- PoP RF SiP Design Case.- SiP Production Data Processing Case.
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