Working in the ever-evolving field of smart chip design within an AI-powered design environment, the authors of this book draw on their experiences in successfully developing system-on-chip (SoC) solutions, having grappled with the emerging design environment, innovative tools, domain-specific challenges, and major design decisions for SOC-based solutions. They present the first comprehensive guide to navigating the technical challenges of SOC-based solutions in emerging application domains, covering various design and development methodologies for system-on-chip solutions for emerging target applications. When diligently applied, the strategies and tactics presented can significantly shorten development timelines, help avoid common pitfalls, and improve the odds of success, especially in AI-powered smart EDA environments. The book provides a detailed insight into SoC-based solutions for various applications, including artificial intelligence (AI), post-quantum security feature enhancements, 3D SOCs, quantum SOCs, photonic SOCs, and SOC solutions for IoT, high-performance computing SOCs, and processor-based systems. The coverage includes architecture exploration methods for targeted applications, compute-intensive SoCs, lightweight SoCs for IOT applications, advanced technology node solutions, and solutions including hardware software co-designs and software-defined SoCs. The strategies best applied in these highly advanced technology developments are discussed in a guest chapter by a practicing high technology strategist so innovators, designers, entrepreneurs, product managers, investors, and executives may properly prepare their companies to succeed.
外文書商品之書封，為出版社提供之樣本。實際出貨商品，以出版社所提供之現有版本為主。部份書籍，因出版社供應狀況特殊，匯率將依實際狀況做調整。
無庫存之商品，在您完成訂單程序之後，將以空運的方式為你下單調貨。為了縮短等待的時間，建議您將外文書與其他商品分開下單，以獲得最快的取貨速度，平均調貨時間為1~2個月。
為了保護您的權益，「三民網路書店」提供會員七日商品鑑賞期(收到商品為起始日)。
若要辦理退貨，請在商品鑑賞期內寄回，且商品必須是全新狀態與完整包裝(商品、附件、發票、隨貨贈品等)否則恕不接受退貨。
