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2024年 (1)
2016年以前 (5)
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King-Ning Tu (3)
Edited by Daniel C. Edelstein 、Takamaro Kikkawa 、Mehmet C. Öztürk 、King-Ning Tu 、Elizabeth J. Weitzman (1)
Edited by Peter Børgesen 、Kenneth A. Jackson 、Robert C. Sundahl 、King-Ning Tu (1)
King-Ning Tu (City University of Hong Kong),Yingxia Liu (City University of Hong Kong) (1)
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PBKTYFRL (1)
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作者:King-Ning Tu  出版社:Taylor & Francis  出版日:2013/10/24 裝訂:精裝
This book comprises theoretical and experimental analysis of various properties of silicon nanocrystals, research methods and preparation techniques, and some promising applications. It comprises nine
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作者:King-Ning Tu  出版社:Springer Verlag  出版日:2007/06/22 裝訂:精裝
The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces
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Electronic Thin Film Reliability
90折
作者:King-Ning Tu  出版社:Cambridge Univ Pr  出版日:2010/12/31 裝訂:精裝
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book
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定價:3379 元, 優惠價:9 3041
Advanced Interconnects and Contacts:VOLUME564
90折
The April 1999 symposium highlights state of the art studies of integration, unit process development, and materials micro-characterization and theory as applied to the problems of submicron and deep-
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定價:1665 元, 優惠價:9 1499
Electronic Packaging Materials Science VIII:VOLUME390
90折
作者:Edited by Peter Børgesen ; Kenneth A. Jackson ; Robert C. Sundahl ; King-Ning Tu  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:1995/09/26 裝訂:平裝
The April 1995 symposium, held as part of the MRS Spring Meeting in San Francisco, emphasized materials research and development and processing issues identified in The National Technology Roadmap fo
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定價:1665 元, 優惠價:9 1499
作者:King-Ning Tu (City University of Hong Kong); Yingxia Liu (City University of Hong Kong)  出版社:PBKTYFRL  出版日:2024/01/19 裝訂:精裝
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