Reliability Technology - Principles And Practice Of Failure Prevention In Electronic Systems

This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal.

• Revolutionary in focus, as it describes how to achieve failure free performance rather than how to predict an acceptable performance failure rate (reliability technology rather than reliability engineering)
• Author has over 40 years experience in the field, and the text is based on classroom tested notes from the reliability technology course he taught at Massachusetts Institute of Technology (MIT), USA?
• Contains graphical interpretations of mathematical models together with diagrams, tables of physical constants, case studies and unique worked examples?

Mr. Norman Pascoe, MIT Consultant (retired), UK
The author has worked for forty three years in the fields of Environmental Testing , Quality and Reliability and Environmental Stress Screening. Since 1996 he has worked as a Reliability Technology consultant to some leading telecommunications and aerospace industries. Before becoming a consultant Norman served for five years as European Product Assurance adviser to Nortel Networks Limited.
Mr Pascoe has presented papers at seminars and conferences in North America, the UK and other European countries. He became a member of the Society of Environmental Engineers in December 1987 and was elected a Fellow of the Society of Environmental Engineers in April 1998.

1 The Origins and Evolution of Quality and Reliability.
1.1 Sixty Years of Evolving Electronic Equipment Technology.
1.2 Manufacturing Processes- From Manual Skills to Automation.
1.3 Soldering Systems.
1.4 Component Placement Machines.
1.5 Automatic Test Equipment.
1.6 Lean Manufacturing.
1.7 Outsourcing.
1.8 Electronic System Reliability - Folklore versus Reality.
1.9 The 'Bathtub Curve'.
1.10 The Truth about Arrhenius.
1.11The Demise of MIL-HDBK-217.
1.12 The Benefits of Commercial Off The Shelf (COTS) Products.
1.13 The MoD SMART Procurement Initiative.
1.14 Why do Items Fail?
1.15 The Importance of Understanding Physics of Failure.
Bibliography.
Summary and Questions.

2 Product Life Cycle Management.
2.1 Overview.
2.2 Project Management.
2.3 Project Initiation.
2.4 Project Planning.
2.5 Project Execution.
2.6 Project Closure.
2.7 A Process Capability Maturity Model.
2.8 When and How to Define the Product Distribution Strategy.
2.9 Transfer of Design to Manufacturing - the Highest Risk Phase.
2.10 Outsourcing - Understanding and Minimising the Risks.
2.11 How Product Reliability is Increasingly Threatened in the 21st. Century.
Bibliography.
Summary and Questions.

3 The Physics of Failure.
3.1 Overview.
3.2 Background.
3.3 Potential Failure Mechanisms in Materials and Components.
3.4 Techniques for Failure Analysis of Components and Assemblies.
3.5 Transition from tin-lead to lead free soldering.
3.6 High Temperature Electronics and Extreme Temperature Electronics.
3.7 Some Illustrations of Failure.
Bibliography.
Summary and Questions.

4 Heat Transfer - Theory and Practice.
4.1 Overview.
4.2 Conduction.
4.3 Convection.
4.4 Radiation.
4.5 Thermal Management.
4.6 Principles of Temperature Measurement.
4.7 Temperature Cycling and Thermal Shock.
Bibliography.
Summary and Questions.

5 Shock and Vibration - Theory and Practice.
5.1 Overview.
5.2 Sources of Shock Pulses in the Real Environment.
5.3 Response of Electronic Equipment to Shock Pulses.
5.4 Shock Testing.
5.5 Product Shock Fragility.
5.6 Shock and Vibration Isolation Techniques.
5.7 Sources of Vibration in the Real Environment.
5.8 Response of Electronic Equipment to Vibration.
5.9 Vibration Testing.
5.10 Vibration Test Fixtures.
Bibliography.
Summary and Questions.

6 Achieving Environmental Test Realism.
6.1 Overview.
6.2 Environmental Testing Objectives.
6.3 Environmental Test Specifications and Standards.
6.4 Quality Standards.
6.5 The Role of the Test Technician.
6.6 Mechanical Testing.
6.7 Climatic Testing.
6.8 Chemical and Biological Testing.
6.9 Combined Environment Testing.
6.10 Electromagnetic Compatibility.
6.11 Avoiding Misinterpretation of Test Standards and Specifications.
Bibliography.
Summary and Questions.

7 Essential Reliability Technology Disciplines in Design.
7.1 Overview.
7.2 Robust Design and Quality Loss Function.
7.3 Six Sigma Quality.
7.4 Concept, Parameter and Tolerance Design.
7.5 Understanding Product Whole Life Cycle Environment.
7.6 Defining User Requirement for Failure Free Operation.
7.7 Component Anatomy, Materials and Mechanical Architecture.
7.8 Design for Testability.
7.9 Design for Manufacturability.
7.10 Defining Product Distribution Strategy.
Bibliography.
Summary and Questions.

8 Essential Reliability Technology Disciplines in Development.
8.1 Overview.
8.2 Understanding and Achieving Test Realism.
8.3 Qualification Testing.
8.4 Stress Margin Analysis and Design Robustness.
8.5 Premature Failure Stimulation.
8.6 Accelerated Ageing v Accelerated Life Testing.
8.7 Design and Proving of Distribution Packaging.
Bibliography.
Summary and Questions.

9 Essential Reliability Technology Disciplines in Manufacturing.
9.1 Overview.
9.2 Manufacturing Planning.
9.3 Manufacturing Process Capability.
9.4 Manufacturing Process Management and Control.
9.5 Non Invasive Inspection Techniques.
9.6 Manufacturing Handling Procedures.
9.7 Lead Free Soldering - A True Perspective.
9.8 Conformal Coating.
9.9 Production Reliability Acceptance Testing.
Bibliography.
Summary and Questions.

10 Environmental Stress Screening (ESS).
10.1 Overview.
10.2 The origins of ESS.
10.3 Thermal Stress Screening.
10.4 Developing a Thermal Stress Screen.
10.5 Vibration Stress Screening.
10.6 Developing a Vibration Stress Screen.
10.7 Combined Environment Stress Screening.
10.8 Other Stress Screening Methodologies.
10.9 Estimating Product Life Consumed by Stress Screening.
10.10 An Environmental Stress Screening Case Study.
Bibliography.
Summary and Questions.

11 Some Worked Examples.
11.1 Overview.
11.1 Peak Thermo-mechanical Stresses in Component Attachments.
11.2 Accelerated Life Factors.
11.3 Cumulative Fatigue Damage.
11.4 Printed Board Assembly Resonant Frequencies.
11.5 Calculating Input PSD Levels in resonant Frequency Bands.
11.6 A Vibration Fixture Design Example for Printed Board Assemblies.

Appendix 1 - Physical Properties of Materials.

Appendix 2 - Unit Conversion Tables.

Index.