商品簡介
Novel measurement techniques, microstructural effects, reliability modelling, stress effects, advanced interconnect reliability, and adhesion and fracture are the concerns of the 49 papers. Invited presentations include discussions of the early detection of the metallization quality using moderately accelerated electromigration stress conditions, modelling electromigration and stress migration damage in advanced interconnect structures, and modelling failure time distributions for interconnects due to stress voiding and electromigration. Annotation c. by Book News, Inc., Portland, Or.
