商品簡介
A December 2003 symposium brought together scientists involved in the processing, characterization, packaging, device design, and applications of passive components for high-frequency devices. Selected papers from the symposium examine issues of materials technology that are key factors for the advancement of high-frequency devices with applications in areas such as mobile phones. The main topics discussed are improvements in low-temperature co-fired ceramics, microstructure-property relationships in perovskites for new materials compositions, tunable ferroelectrics allowing low-cost solutions for frequency tuning and phase shifters, new integration platforms and packaging concepts, embedded capacitors, bulk acoustic wave resonators, and above chip integration. Annotation c2004 Book News, Inc., Portland, OR (booknews.com)
