商品簡介
An October 2007 conference highlighted the latest R&D and manufacturing results, as well as real-world integration and reliability data, on the application of metallization and related technologies for advanced IC devices. Papers from the conference describe recent work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design, and vertical integration. Papers from the conference are presented here, in sections on barrier metals and silicides, CMP and cleaning, copper deposition, design and interconnect modeling, integration, low-k, metal resistivity, packaging and 3D integration, and reliability and yield. Some specific topics include the drying effect on hydrophobic and hydrophilic films by IPA, optical measurement of metal film thickness, signal transmission through interconnects with repetitive loads, and evolution of grain size and crystallographic orientation in narrow lines. Annotation c2008 Book News, Inc., Portland, OR (booknews.com)
