Human-in-the-loop ― Probabilistic Modeling of an Aerospace Mission Outcome

Improvements in safety in the air and in space can be achieved through better ergonomics, better work environments, and other efforts of the traditional avionic psychology that directly affect human behaviors and performance. Not limited to just the aerospace field, this book discusses adaptive probabilistic predictive modeling in human-in-the-loop situations. This involves situations where human performance and equipment reliability contributes jointly to the success and safety of a mission. This book gets you familiar with a new, powerful, flexible, and effective approach to making outcomes from missions successful and safe.

Dr. E. Suhir is on the faculty of the Portland State University, Portland, OR, USA, and Vienna Institute of Technology, Vienna, Austria. He is Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics Packaging Society (IMAPS); Fellow the Institute of Physics, UK; and the Society of Plastics Engineers (SPE). Ephraim holds 22 US patents and has authored and co-authored above 400 technical publications (papers, book chapters, books, and peer-reviewed conference proceedings), presented numerous keynote and invited talks worldwide, and received many professional awards. Also by Ephraim Suhir

Structural Analysis in Microelectronic and Fiber Optic Systems: Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis, Van Nostrand Reinhold, New York, 1991

Applied Probability for Engineers and Scientists, McGraw Hill, New York, 1997.

Dynamic Response of Microelectronic Systems to Shocks and Vibrations, John Wiley, New York, 2011 (co-edited with D. Steinberg, and T. Yi)

Reliability of Photonic Materials and Structures, MRS Symposia Proceedings, vol. 531, 1998 (co-edited with M. Fukuda and C. R. Kurkjian) .

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, 2 volumes, Springer, 2008 (co-edited with CP Wong and YC Lee)