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2020~2021 (3)
2018~2019 (4)
2016年以前 (11)
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平裝 (9)
精裝 (15)
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Friedrich Pecht (6)
Pecht (5)
Prabhakar V. Varde/ Michael G. Pecht (2)
Haleh Ardebili/ Michael Pecht (1)
Jeanette Pecht (1)
Jiawei Zhang/ Haleh Ardebili/ Michael Pecht/ James J. Licari (EDT) (1)
Jun Dai/ Michael M. Ohadi/ Diganta Das/ Michael G. Pecht (1)
Karen Hess Rogers/ Lee Pecht/ Alan Harris Bath/ John B. Boles (INT) (1)
Mellal, Mohamed Arezki (Associate Professor, Department of Mechanical Engineering, Faculty of Technology, M'Hamed Bougara University, Algeria),Pecht, Michael G. (CALCE (Center for Advanced Life Cycle (1)
Michael G. Pecht (EDT)/ Rakesh Agarwal/ Patrick McCluskey/ Terrance Dishongh/ Sirus Javadpour/ Rahul Mahajan (1)
Michael Pecht (EDT) (1)
PECHT (1)
Preeti Chauhan/ Anupam Choubey/ Zhaowei Zhong/ Michael Pecht (1)
Wm Pecht (1)
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John Wiley & Sons Inc (5)
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LEGARE STREET PR (2)
Springer Nature (2)
Springer Verlag (2)
CRC Press UK (1)
Elsevier Science Ltd (1)
Elsevier Science Publishing Co Inc (1)
JOHN WILEY & SONS,LTD (1)
Taylor & Francis (1)
Texas A & M Univ Pr (1)
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三民網路書店 / 搜尋結果

24筆商品,1/2頁
PROGNOSTICS AND HEALTH MANAGEMENT OF ELECTRONICS
作者:PECHT  出版社:JOHN WILEY & SONS;LTD  出版日:2008/08/13 裝訂:精裝
The first book on Prognostics and Health Management of Electronics Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early wa
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02-25006600[分機130、131]。
Prognostics And Health Management Of Electronics - Fundamentals, Machine Learning, And The Internet Of Things
作者:Pecht  出版社:John Wiley & Sons Inc  出版日:2018/08/28 裝訂:精裝
An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenanceA road map to the current challenges and available opportunities for the research
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02-25006600[分機130、131]。
Quality Conformance And Qualification Of Microelectronic Packages And Interconnects
作者:Pecht  出版社:John Wiley & Sons Inc  出版日:1994/11/07 裝訂:平裝
All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted
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02-25006600[分機130、131]。
Soldering Processes And Equipment
作者:Pecht  出版社:John Wiley & Sons Inc  出版日:1993/06/04 裝訂:精裝
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamina
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02-25006600[分機130、131]。
Parts Selection And Management
作者:Pecht  出版社:John Wiley & Sons Inc  出版日:2004/01/14 裝訂:精裝
Increase profitability and reduce risk through effective parts selection and managementCorporations recognize that technology can be the key to fueling product design and development. But just as cruc
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02-25006600[分機130、131]。
Integrated Circuit, Hybrid, And Multichip Module Package Design Guidelines: A Focus On Reliability
作者:Pecht  出版社:John Wiley & Sons Inc  出版日:1994/02/15 裝訂:精裝
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential fo
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Machine Learning: Python Tutorial For Absolute Beginners, Programming And Learning Deeply: Introduction To Machine Learning Python
作者:Wm Pecht  出版社:Independently published  出版日:2021/02/05 裝訂:平裝
定價:318 元, 優惠價:1 318
無庫存,下單後進貨(到貨天數約30-45天)
Schiller-Galerie
作者:Friedrich Pecht  出版社:Outlook Verlag  出版日:2022/05/07 裝訂:精裝
定價:3196 元, 優惠價:1 3196
無庫存,下單後進貨(到貨天數約30-45天)
Schiller-Galerie
作者:Friedrich Pecht  出版社:Outlook Verlag  出版日:2022/05/07 裝訂:平裝
定價:2396 元, 優惠價:1 2396
無庫存,下單後進貨(到貨天數約30-45天)
Ein Winter in Venedig.
滿額折
作者:Friedrich Pecht  出版社:LEGARE STREET PR  出版日:2022/10/27 裝訂:精裝
定價:1438 元, 優惠價:1 1438
無庫存,下單後進貨(到貨天數約30-45天)
Ein Winter in Venedig.
滿額折
作者:Friedrich Pecht  出版社:LEGARE STREET PR  出版日:2022/10/27 裝訂:平裝
定價:853 元, 優惠價:1 853
無庫存,下單後進貨(到貨天數約30-45天)
Deutsche Künstler des neunzehnten Jahrhunderts: Erste Reihe
作者:Friedrich Pecht  出版社:Outlook Verlag  出版日:2023/12/27 裝訂:精裝
定價:3196 元, 優惠價:1 3196
無庫存,下單後進貨(到貨天數約30-45天)
Deutsche Künstler des neunzehnten Jahrhunderts: Erste Reihe
作者:Friedrich Pecht  出版社:Outlook Verlag  出版日:2023/12/27 裝訂:平裝
定價:2396 元, 優惠價:1 2396
無庫存,下單後進貨(到貨天數約30-45天)
Encapsulation Technologies for Electronic Applications
作者:Haleh Ardebili; Michael Pecht  出版社:William Andrew Pub  出版日:2009/06/11 裝訂:精裝
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environme
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Product Maintainability Supportability Handbook
作者:Michael Pecht (EDT)  出版社:CRC Press UK  出版日:2009/04/09 裝訂:精裝
To ensure product reliability, an organization must follow specific practices during the product development process that impact reliability. The second edition of the bestselling Product Reliability,
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Risk-based Engineering ― An Integrated Approach to Complex Systems - Special Reference to Nuclear Plants
作者:Prabhakar V. Varde; Michael G. Pecht  出版社:Springer Nature  出版日:2019/01/19 裝訂:平裝
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Risk-based Engineering ― An Integrated Approach to Complex Systems - Special Reference to Nuclear Plants
作者:Prabhakar V. Varde; Michael G. Pecht  出版社:Springer Nature  出版日:2018/05/01 裝訂:精裝
The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Optimum Cooling of Data Centers ― Application of Risk Assessment and Mitigation Techniques
作者:Jun Dai; Michael M. Ohadi; Diganta Das; Michael G. Pecht  出版社:Springer Verlag  出版日:2013/11/30 裝訂:精裝
This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installa
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Copper Wire Bonding
作者:Preeti Chauhan; Anupam Choubey; Zhaowei Zhong; Michael Pecht  出版社:Springer Verlag  出版日:2013/07/31 裝訂:精裝
Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage o
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
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