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Semiconductor Processes and Integration
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出版日:2025/12/01 作者:Yung Chun Wu  出版社:新加坡商聖智學習亞洲私人有限公  裝訂:平裝
Semiconductor Processes and Integration is a comprehensive book that systematically covers semiconductor fabrication and integration technologies across multiple generations of transistor architectures, including MOSFETs, FinFETs, GAAFETs, and CFETs. This book's academic contribution lies in modernizing teaching materials and bridging the gap between industry and academia. This book contains 14 chapters. It begins with the fundamentals of semiconductor materials and physics, followed by detailed discussions of key unit processes such as oxidation, lithography, ion implantation, etching, CVD, metallization, and planarization.The text further explores advanced process integration for both 2D planar and 3D FinFET devices, incorporating modern innovations such as strained silicon channels, high-k gate dielectrics, and metal gate technologies. Additionally, it introduces essential material characterization techniques, including SEM, TEM, X-ray spectroscopy, and Raman spectroscopy, and exten
定價:1480 元
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