商品簡介
These proceedings from the November 2006 symposium describe current trends, requirements and recent developments in electronic materials for applications in wireless (including RF, microwave, millimeter and THz frequency range), communication and portable devices. The papers here cover packaging and embedded components, including an invited paper on the influence of full-filled polymer molding on high-frequency circuits, system-in package, including papers on a breakthrough in miniaturization and nano-integration supported by very high quality passives and system level design tools, process and material requirements for successful heterogeneous passive component integration in RF systems and through wafer interconnects in a technology that goes beyond medical applications. Papers on MEMs include single-mode polymer optical fiber sensors for large strain applications and the paper on magnetic components covers power and radio frequency indicators using a hybrid ferrite-flex foil technology. The collection include symposium posters. Annotation c2007 Book News, Inc., Portland, OR (booknews.com)
