滿額折
Thermal Management of Microelectronic Equipment ― Heat Transfer Theory, Analysis Methods and Design Practices
商品資訊
系列名：Asme Press Book Series on Electronic Packaging
ISBN13：9780791801680
出版社：Amer Society of Mechanical
作者：Lian-Tuu Yeh; Richard C. Chu
出版日：2001/09/01
裝訂／頁數：精裝／414頁
規格：24.1cm*15.9cm*3.2cm (高/寬/厚)
定價
：NT$ 5250 元若需訂購本書，請電洽客服 02-25006600[分機130、131]。
商品簡介
商品簡介
Veteran researchers Yeh and Chu (both have worked in the field for decades and published extensively) describe the factors behind the thermal performance of electronics and provide details on the wide range of subjects and solutions necessary for different applications. The physics of heat transfer is described at length, including the fundamentals of various heat transfer modes and thermal interface resistances. Appendices provide property tables for solids and 16 types of fluids. This text will be useful for advanced undergraduate and graduate courses. Annotation c. Book News, Inc., Portland, OR (booknews.com)
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