滿額折
CHARACTERIZATION OF hBN REINFORCED POLYESTER COMPOSITES
商品資訊
ISBN13：9789359252087
出版社：WRITAT
作者：Akash Deep Kushwaha
出版日：2024/06/01
裝訂：平裝
規格：21.6cm*14cm*1cm (高/寬/厚)
商品簡介
商品簡介
The polymer composites developed in the present investigation are expected to have adequate potential for a wide variety of applications, particularly in microelectronic industries. With elevated mechanical properties like tensile strength, flexural strength, compressive strength and hardness also with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric characteristics, the polyester-based composites with appropriate proportions of fillers can be used in microelectronic applications like electronic packaging, encapsulations, printed circuit board substrates etc.
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