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出版日:2014/06/04 作者:Garrou  出版社:John Wiley & Sons Inc  裝訂:平裝
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology.As such,
若需訂購本書,請電洽客服 02-25006600[分機130、131]。
出版日:2012/09/19 作者:Garrou  出版社:John Wiley & Sons Inc  裝訂:平裝
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics deve
若需訂購本書,請電洽客服 02-25006600[分機130、131]。
Enabling Technologies for 3-D Integration:VOLUME970
90 折
出版日:2007/03/30 作者:Edited by Christopher A. Bower ; Philip E. Garrou ; Peter Ramm ; Kenji Takahashi  出版社:CAMBRIDGE UNIVERSITY PRESS  裝訂:平裝
Three-dimensional integrated circuit integration is an emerging technology or device architecture based on the system performance gains that can be achieved by stacking and vertically inter-connecting
優惠價: 9 1499
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