This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;Va
The book is devoted to a new direction - heteromagnetic microelectronics, microsystems of active type, research and development which will lead to the creation of new types of devices, CHIP’S, includi
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-fr
Silicon-based microelectronics has steadily improved in various performance-to-cost metrics. But after decades of processor scaling, fundamental limitations and considerable new challenges have emerge
Materials Science is predicated on the understanding of why materials behave in the way that they do. This set, consisting of Surfaces, Interfaces, and Films for Microelectronics and Electronic Materi
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisturediscusses how the reliability of packaging components is a prime concern to electronics manufacturers.The
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development
The second edition of Nanotechnology for Microelectronics and Photonics has been thoroughly revised, expanded, and updated. The aim of the book is to present the most recent advances in the field of n
In the summer of 2009, leading professionals from industry, government, and academia gathered for a free-spirited debate on the future trends in microelectronics. This volume represents the summary of
With the rapid growth of wireless communications, this book meets a strong demand for information and new research in the area of antenna, signal processing, and microelectronics engineering. Providin
This volume contains 73 papers presented at ICMEET 2015: International Conference on Microelectronics, Electromagnetics and Telecommunications. The conference was held during 18 – 19 December, 2015 at