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MRS Conference Proceedings

系列：MRS Conference Pr...
共 23 筆
第1 / 1 頁
Advanced Metallization Conference 2008 (AMC 2008)：VOLUME24
90 折
1.

Advanced Metallization Conference 2008 (AMC 2008)：VOLUME24
出版日：2009/04/08 作者：Mehul Naik  出版社：Cambridge Univ Pr  裝訂：精裝
The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.
若需訂購本書，請電洽客服 02-25006600[分機130、131]。
Advanced Metallization Conference 2007 (AMC 2007)：VOLUME23
90 折
2.

Advanced Metallization Conference 2007 (AMC 2007)：VOLUME23
出版日：2008/05/07 作者：Edited by A. J. McKerrow ; Y. Sacham-Diamand ; S. Shingubara ; Y. Shimogaki  出版社：CAMBRIDGE UNIVERSITY PRESS  裝訂：平裝
An October 2007 conference highlighted the latest R&D and manufacturing results, as well as real-world integration and reliability data, on the application of metallization and related technologie
若需訂購本書，請電洽客服 02-25006600[分機130、131]。
Advanced Metallization Conference 2006 (AMC 2006)：VOLUME22
90 折
3.

Advanced Metallization Conference 2006 (AMC 2006)：VOLUME22
出版日：2007/02/09 作者：Stephen W. Russell  出版社：Materials Research Society  裝訂：精裝
The Advanced Metallization Conference 2006 - held in Tokyo and San Diego, California - highlights both current state-of-the-art and ongoing challenges associated with multilevel interconnects. Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on 'Nanostructured Materials for Interconnects' is featured.
若需訂購本書，請電洽客服 02-25006600[分機130、131]。
Quasi-Elastic Neutron Scattering Conference 2006 (QENS2006)
90 折
4.

Quasi-Elastic Neutron Scattering Conference 2006 (QENS2006)
出版日：2007/01/01 作者：Paul E. Sokol  出版社：Materials Research Society  裝訂：精裝
Researchers from around the world come together in this proceedings of the 8th International Conference on Quasi-Elastic Neutron Scattering to discuss recent advances in quasi-elastic neutron scattering - in fields ranging from physics to biology - as well as applications, instrumentation, theory and complementary techniques. Topics include: hydration water, water dynamics, protein dynamics, confined molecules, biological systems, molecular dynamics, molecular diffusion, superionic glass, polymers, soft matter, magnetism, and instrumentation.
優惠價： 9 3509
無庫存
Advanced Metallization Conference 2005 (AMC 2005)：VOLUME21
90 折
5.

Advanced Metallization Conference 2005 (AMC 2005)：VOLUME21
出版日：2006/01/01 作者：Sywert H. Brongersma  出版社：Materials Research Society  裝訂：精裝
Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
優惠價： 9 1345
無庫存
Advanced Metallization Conference 2003 (AMC 2003)：VOLUME19
90 折
6.

Advanced Metallization Conference 2003 (AMC 2003)：VOLUME19
出版日：2004/01/01 作者：Gary W. Ray  出版社：Materials Research Society  裝訂：精裝
The Advanced Metallization Conference (AMC) marked its twentieth anniversary in 2003. Technical leaders from around the world gather to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, vertical integration, advanced packaging and optical interconnects. In particular, presentations highlight both the advances and future challenges associated with multilevel interconnect. The latest developments in the integration of copper-based metallization with low-dielectric constant materials, and advances in the understanding of copper morphology and the reliability of the component materials of interconnect systems, are featured. Additional contributions discuss the development of advanced materials and advanced process technologies. Optimization of interconnect performance and density, and alternatives to metal-based interconnect, are addressed in papers on interconnect perfor
優惠價： 9 1187
無庫存
Advanced Metallization Conference 2002 (AMC 2002)：VOLUME18
90 折
7.

Advanced Metallization Conference 2002 (AMC 2002)：VOLUME18
出版日：2003/01/01 作者：Edited by B. M. Melnick ; T. S. Cale ; S. Zaima ; T. Ohta  出版社：CAMBRIDGE UNIVERSITY PRESS  裝訂：平裝
優惠價： 9 1499
無庫存
Advanced Metallization Conference 2000 (AMC 2000)：VOLUME16
90 折
8.

Advanced Metallization Conference 2000 (AMC 2000)：VOLUME16
出版日：2002/03/01 作者：Dan Edelstein  出版社：Materials Research Society  裝訂：精裝
This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for this year's volume is on the rapid advances in copper and low-K. The volume is divided into nine parts: Part I contains an invited perspective on the state of semiconductor research and development in Japan; Part II focuses on performance aspects of interconnect architectures; Part III includes some of the most significant recent advances in copper/low-K integration; Part IV is an in-depth collection of electrochemical and chemical processes, mainly pertaining to copper; Part V contains state-of-the-art papers on thin-film diffusion barriers, again mainly for copper wiring; Part VI covers reliability engineering and results; Part VII is a collection of alternative and novel processes and systems related to circuit interconnection; Part VIII contains papers on specific low-K dielectrics and their properties, and new methods for their characterizatio
優惠價： 9 1345
無庫存
Advanced Metallization Conference 2001 (AMC 2001)：VOLUME17
90 折
9.

Advanced Metallization Conference 2001 (AMC 2001)：VOLUME17
出版日：2002/01/01 作者：Andrew J. McKerrow  出版社：Materials Research Society  裝訂：精裝
Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at AMC 2001 include the latest developments in integrating copper metallization with low-dielectric constant materials, and evaluations of the reliability of such interconnects. Recently, in both industry and academia there has been increased interest in basic research as applied to the field of vertical integration. Since the problems that affect vertical integration are similar to those of VLSI interconnects, it is natural to include the topic here. In fact, it is anticipated that cross fertilization between the fields of VLSI metallization and vertical interconnect will yield a viable technical solution to the problem of multichip integration. This book offers a comprehensive look at the current state of the art of VLSI interconnects. Topics include: process integration; vertical integration
優惠價： 9 1345
無庫存
Advanced Metallization Conference in 1998 (AMC 1998)：VOLUME14
90 折
10.

Advanced Metallization Conference in 1998 (AMC 1998)：VOLUME14
出版日：2000/02/01 作者：Gurtej S. Sandhu  出版社：Materials Research Society  裝訂：精裝
優惠價： 9 1345
無庫存
Advanced Metallization and Interconnect Systems for ULSI Applications in 1996：VOLUME12
90 折
11.

Advanced Metallization and Interconnect Systems for ULSI Applications in 1996：VOLUME12
出版日：2000/02/01 作者：Robert Havemann  出版社：Materials Research Society  裝訂：精裝
優惠價： 9 1286
無庫存
Advanced Metallization and Interconnect Systems for ULSI Applications in 1995：VOLUME11
90 折
12.

Advanced Metallization and Interconnect Systems for ULSI Applications in 1995：VOLUME11
出版日：2000/02/01 作者：Russell C. Ellwanger  出版社：Materials Research Society  裝訂：精裝
優惠價： 9 1286
無庫存
Proceedings of the 12th International Zeolite Conference 4 Volume Set
90 折
14.

Proceedings of the 12th International Zeolite Conference 4 Volume Set
出版日：2000/02/01 作者：M. M. J. Treacy  出版社：Materials Research Society  裝訂：精裝
As zeolite science continues to grow, many zeolite conferences and meeting are being held around the world, but the premier venue to present new work continues to be the International Zeolite Conferences. The 12th International Zeolite Conference was held in Baltimore, Maryland, in July 1998, and included 774 participants from 37 different countries. It also spawned this comprehensive four-volume, 3360-page proceedings that covers many diverse areas of zeolite study only touched upon at previous conferences. Topics include: diffusion; adsorption; theory and modeling; structure; industrial applications; synthesis; catalysis; membranes; mesoporous materials; solid-state applications and characterization.
若需訂購本書，請電洽客服 02-25006600[分機130、131]。
Advanced Metallization Conference 1999 (AMC 1999)：VOLUME15
90 折
15.

Advanced Metallization Conference 1999 (AMC 1999)：VOLUME15
出版日：2000/01/01 作者：Edited by M. E. Gross ; T. Gessner ; N. Kobayashi ; Y. Yasuda  出版社：CAMBRIDGE UNIVERSITY PRESS  裝訂：平裝
優惠價： 9 1499
無庫存
Tungsten and Other Advanced Metals for ULSI Applications in 1990：VOLUME6
90 折
16.

Tungsten and Other Advanced Metals for ULSI Applications in 1990：VOLUME6
出版日：1991/03/01 作者：Edited by G. C. Smith ; R. Blumenthal  出版社：CAMBRIDGE UNIVERSITY PRESS  裝訂：平裝
Proceedings of the Seventh Workshop on [title] held in Dallas, Texas, October 1990. Papers summarize the latest results in reactor design, selective tungsten deposition, effects of nucleation layers o
優惠價： 9 1499
無庫存
Tungsten and Other Refractory Metals for VLSI Applications III：VOLUME3
90 折
17.

Tungsten and Other Refractory Metals for VLSI Applications III：VOLUME3
出版日：1988/04/01 作者：Victor A. Wells  出版社：Cambridge Univ Pr  裝訂：精裝
優惠價： 9 1345
無庫存
Tungsten and Other Refractory Metals for VLSI Applications II：VOLUME2
90 折
18.

Tungsten and Other Refractory Metals for VLSI Applications II：VOLUME2
出版日：1987/12/01 作者：Edited by E. K. Broadbent  出版社：CAMBRIDGE UNIVERSITY PRESS  裝訂：平裝
優惠價： 9 1499
無庫存
9th International Munich Chassis Symposium 2018 ― Chassis.tech Plus
19.

9th International Munich Chassis Symposium 2018 ― Chassis.tech Plus
出版日：2018/09/26 作者：Peter Pfeffer (EDT)  出版社：Vieweg + Teubner Verlag  裝訂：平裝
若需訂購本書，請電洽客服 02-25006600[分機130、131]。
Heavy-Duty-, On- und Off-Highway-Motoren 2016：Global Engineering - 11. Internationale MTZ-Fachtagung
95 折
20.

Heavy-Duty-, On- und Off-Highway-Motoren 2016：Global Engineering - 11. Internationale MTZ-Fachtagung
出版日：2017/09/19 作者：Siebenpfeiffer; Wolfgang  出版社：Springer Fachmedien Wiesbaden  裝訂：平裝
若需訂購本書，請電洽客服 02-25006600[分機130、131]。
6th International Munich Chassis Symposium 2015 ─ Chassis.tech Plus
90 折
21.

6th International Munich Chassis Symposium 2015 ─ Chassis.tech Plus
出版日：2015/06/26 作者：Peter Pfeffer (EDT)  出版社：Springer Verlag  裝訂：平裝
Connectivity has arrived in the vehicle - whether it is in-car internet or car-to-car communication. For the chassis too, the connected car is increasingly becoming a driver of innovation. Predictive
若需訂購本書，請電洽客服 02-25006600[分機130、131]。
Isotopes in Hydrology, Marine Ecosystems and Climate Change Studies ― Proceedings of the International Symposium Held in Monaco, 27 March - 1 April 2011
22.

Isotopes in Hydrology, Marine Ecosystems and Climate Change Studies ― Proceedings of the International Symposium Held in Monaco, 27 March - 1 April 2011
出版日：2013/07/01 作者：Not Available (NA)  出版社：Renouf Pub Co Ltd  裝訂：平裝
若需訂購本書，請電洽客服 02-25006600[分機130、131]。
  • 共 23筆
    第 1 頁

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