An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenanceA road map to the current challenges and available opportunities for the research
Increase profitability and reduce risk through effective parts selection and managementCorporations recognize that technology can be the key to fueling product design and development. But just as cruc
All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamina
The first book on Prognostics and Health Management of Electronics Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early wa
To ensure product reliability, an organization must follow specific practices during the product development process that impact reliability. The second edition of the bestselling Product Reliability,
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environme
The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and
Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage o
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsula
This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installa
本書由美國馬裡蘭大學先進壽命週期工程中心（CALCE）Michael G. Pecht教授和Myeongsu Kang博士共同編寫，系統介紹了在物聯網和人工智能背景下電子產品故障預測與健康管理的理論基礎、技術方法及應用案例。本書主要內容涵蓋PHM概述、PHM傳感系統、基於失效物理的PHM、機器學習（基本原理、數據預處理、異常檢測、診斷與預測）、預測學的不確定性、PHM成本和投資收益、PHM維護決策、電子電路健康和剩餘使用壽命估計、基於PHM的電子產品認證、鋰離子電池PHM、發光二極管PHM、醫療衛生PHM、海底線纜PHM、互聯車輛的故障診斷與故障預測、PHM在商用飛機中作用、電子產品PHM軟件、e-維護、物聯網時代的預測性維護、電子產品PHM專利分析、電子密集型系統PHM技術路線圖等。
“From its founding, Rice University has been an institution devoted to making a strong impact on the world,” according to current president David Leebron. Nestled near Houston’s cultural heart, Rice U
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical cond
